IC Test Engineer
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Recruiter screen, a technical screen mixing resume deep-dive with live coding, a hiring-manager conversation, then a panel of three to five 45–60 minute rounds: coding, systems design under hardware constraints, a domain deep-dive, and behavioral. Highly team-specific — you interview directly with the team — with C++ depth expected almost universally and decisions sometimes taking five-plus weeks after the panel.
Read the full NVIDIA interview process →Description
NVIDIA’s Networking organization is looking for a highly motivated and independent Test & Product Engineer to join our new IC Test Engineering team in Taiwan.
In this role, you will play a key part in transitioning cutting-edge Networking silicon products (Switches, NICs, SmartNICs) from post-silicon bring-up into stable, scalable mass production.
The position focuses on hands-on execution around production readiness, manufacturing test, yield improvement, and product stabilization, while working closely with global design, validation, and
manufacturing teams.
What you’ll be doing:
Define, develop, and maintain IC production test programs from wafer sort through final test.
Design and optimize factory test plans to improve coverage, test time, yield, and cost.
Own production execution aspects, handling issues including debug, root-cause analysis, and corrective actions.
Drive continuous improvements in production flows, automation, and infrastructure.
Work closely with Design, Architecture, DFT, Q&R, Software, and Manufacturing teams across geographies.
Coordinate with overseas factories and partners to ensure scalable and reliable manufacturing.
What we need to see:
B.Sc. in Electrical Engineering
3+ years of experience in Test and Product Engineering
Strong understanding of IC manufacturing flows and production test methodologies.
Hands-on coding or scripting experience (Python, C/C++, VBA, or similar).
Strong execution mindset with high ownership and accountability.
Ability to work effectively with cross-functional and geographically distributed teams.
Good written and verbal communication skills in English.
Ways to stand out from the crowd:
Experience with IC testers such as Teradyne UltraFlex or similar platforms.
Background in Networking silicon (Ethernet, InfiniBand, high-speed interfaces).
Experience working directly with high-volume manufacturing.
Experience driving yield improvement and cost reduction initiatives.